| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor package having an unleaded solder ball attached, and its manufacturing method. <P>SOLUTION: The semiconductor package 300 is provided, which contains copper of 0.1-0.3 wt.% in a solder joint region 106 where the unleaded solder ball 103 is attached. The solder ball on an intermediate solder ball joint of the semiconductor package contains silver of 3.0-4.0 wt.%, copper of 0.1-0.3 wt.%, and tin of the residual wt.%. Thus, impact resistance of the package can be remarkably improved. <P>COPYRIGHT: (C)2007,JPO&INPIT |
