| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an electronic component wiring method between electrodes of an electronic component with a conductive paste mainly consisting of metal acetylide component in place of a conventional plating method, and to provide an electronic component manufactured by the electronic component wiring method. <P>SOLUTION: In the electronic component wiring method, a conductive paste film is formed by coating a conductive paste containing metal acetylide compound on an electrode of an electronic component, and the conductive paste film is heated and baked to form a metallic film, and connected to the other electrode. Thus, any complicated process such as one in the conventional plating method is not required, and the manufacturing cost can be considerably reduced. Further, the conductive paste can form a very thin metallic film, and the thickness can be considerably reduced compared with that of a conventional product when the metallic film is used for an electrode connection method of multi-layered electronic components. Thus, the miniaturization and high density of the electronic components can be achieved. <P>COPYRIGHT: (C)2007,JPO&INPIT |
