| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive composition excellent in resolution even in formation of a fine pattern of ≤100 nm and improved in line edge roughness and pattern collapse, and a pattern forming method using the composition, with respect to a positive photosensitive composition used in a process of producing a semiconductor such as IC, in production of a circuit board of a liquid crystal, a thermal head or the like, and in another photofabrication process, and a pattern forming method using the composition. <P>SOLUTION: The positive photosensitive composition comprises: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B1) a resin capable of decomposing under an action of an acid to increase its solubility in an alkali developer; and (B2) a resin that has at least one group selected from (a) an alkali-soluble group and (b) a group capable of decomposing under an action of an alkali to produce an alkali-soluble group, and the resin (B2) does not have a group capable of decomposing under an action of an acid. The pattern forming method using the composition is also provided. <P>COPYRIGHT: (C)2007,JPO&INPIT |
