| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a warp preventing heat spreader of a semiconductor device. <P>SOLUTION: The heat spreader is constituted of a metal thin plate having a substantially constant thickness, and at least one opening is formed. Therefore, it is made possible for an adhesive or resin to be exuded of the opening. The heat spreader stiffens a package by bonding firmly each other components of the package (that is, a circuit substrate, a die, the heat spreader, and a stiffening frame). At the same time, the heat spreader dissipates heat generated from the die. In addition, it is possible to easily mount the heat spreader to the die by arranging the heat spreader and filling it with a mold resin. The mold resin flows through the opening readily and fills a gap between the heat spreader and the die. Further, the mold resin replaces air passing through the gap, and makes it exit from the opening. <P>COPYRIGHT: (C)2007,JPO&INPIT |
