| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a bonding apparatus for efficiently carrying out surface treatment and bonding treatment. <P>SOLUTION: This bonding apparatus comprises a capillary 40 having a high-frequency coil 50 wound about the tip thereof and a bonding wire 2 inserted into it, a position changing portion for changing the position of the tip of the bonding wire 2, a gas supply for supplying a gas to the capillary 40, and a high-frequency power supply for supplying high-frequency power to the high-frequency coil 50. When the bonding wire 2 is outside the plasma region 52, the micro-plasma formed in the plasma region 52 is jetted from the opening 48 to remove the surface of a bonding target. When the bonding wire 2 is inserted into the plasma region 52; the material of the bonding wire 2 is changed into particles and the micro-plasma 303 containing the particles of that sputtered gold is jetted from the opening 48, and the material same as that of the bonding wire 2 is deposited on the surface of the bonding target. <P>COPYRIGHT: (C)2007,JPO&INPIT |
