| 摘要 |
PROBLEM TO BE SOLVED: To provide a system for manufacturing a semiconductor device capable of suppressing the formation of a defective product as much as possible in a mounting process. SOLUTION: The system for manufacturing the semiconductor device comprises a mounting process 1 for mounting an IC chip on a semiconductor substrate to obtain the semiconductor device, an inspecting process 2 for inspecting the semiconductor device obtained in the mounting process 1, and an evaluating process 3 for preliminarily evaluating the semiconductor substrate before the mounting process 1. An analyzing process 4 for simulation analyzing damage such as internal stress generated in the semiconductor substrate at the time of mounting is provided on the basis of the present mounting condition of the mounting process 1 concurrently with an input of prior evaluation data obtained in the evaluating process 3 and design data related to the semiconductor substrate, and the mounting condition in the mounting process 1 is varied so that the generation of internal damage analyzed by the analyzing process 4 can be suppressed. COPYRIGHT: (C)2007,JPO&INPIT
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