发明名称 MICROELECTRONICS PACKAGE AND METHOD
摘要 A lightwire (120) segment in the form of an elongated substrate frame (12) composed of a flat flexible thin elongated sheet of plastic dielectric material having a copper film (14) laminated on at least one side; a plurality of cavities (17) longitudinally spaced along th elongated substrate (12), a LED diode (10) having first and second contacts (18) embedded in each of the cavities (17) of the substrat (12); the copper film (14) on one side of the substrate (12) defining two interconnects (34, 35) separated by a dielectric space, one interconnect (34 or 35) having a tab (46) bonded to the first contact (18) of each LED diode (10), and the other interconnect (34 or 35) having a tab (46) bonded to the second contact (18) of each LED diode (10). A lightwire (120) made from a plurality of segment that are bonded together in series or parallel. A micropackage made from a substrate frame (12) composed of a flat flexible thin shee of plastic dielectric material having a copper film (14) laminated on one side defining rows and columns of component sites separated from one another by thin webs to be readily detached from the substrate frame (12). The micropackage has indexing elements to position the substrate frame (12) relative to a machine that can pick the component sites out of the frame. Each component site define a cavity (17) formed in the substrate (12), and the copper film (14) laminated on the substrate defines two separated interconnects (34 35), each having a tab (46) extending into the cavity (17) formed in the substrate (12). An electrical component having contacts (18) i positioned in the cavity (17) and its contacts (18) are bonded to the tabs (46).
申请公布号 WO2006044739(A3) 申请公布日期 2007.01.18
申请号 WO2005US37158 申请日期 2005.10.18
申请人 INTRAGLOBAL CORPORATION;GREGORY, JOHN 发明人 GREGORY, JOHN
分类号 H02H1/00;H01L33/48 主分类号 H02H1/00
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