SHEET ADHERING APPARATUS AND SHEET ADHERING METHOD

摘要

A sheet adhering apparatus (10) is provided with a sheet feeding unit (12) for feeding an adhesive sheet (S) to a position where a plane of a semiconductor wafer (W) faces, and a pressing roller (14) for adhering the adhesive sheet (S) to the wafer (W) by applying a pressing force to the adhesive sheet (S). The sheet feeding unit (12) includes a tension measuring means (35) for measuring tension of the adhesive sheet (S) between a feeding head (49) and the pressing roller (14), and mixing of bubbles between the adhesive sheet (S) and the wafer (W), and wafer warping deformation after sheet adhesion are prevented by maintaining the tension fixed by the tension measuring means (35).