| 摘要 |
<P>PROBLEM TO BE SOLVED: To enable ball-less bonding, without having to modify an existing wire bonding device at all, and to improve junction properties in bonding. <P>SOLUTION: A tail section 11 is formed to a length, projecting slightly from the tip section of a capillary 6. In a first bonding process, the tail section 11 is bonded to a first bond point to form a first lower-bonding section 20, a wire 10 is overlapped to the first lower-bonding section 20 for connection, to form a first intermediate bonding section 22, and the wire 10 is overlapped onto the first intermediate bonding section 22 for connection to form a first upper-bonding section 24. In a second bonding process, the wire 10 is bonded to a second bond point to form a second lower-bonding section 30, and the wire 10 is overlapped to the second lower-bonding section 30 again for connection, to form a first upper-bonding section 32. <P>COPYRIGHT: (C)2007,JPO&INPIT |
