发明名称 HEAT DISSIPATION COMPONENT AND MANUFACTURING METHOD THEREOF
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a heat dissipation component capable of efficiently diffusing and dissipating heat from a heat-generating component. <P>SOLUTION: The heat dissipation component consists of a heat diffusing sheet 1, and a thermally conductive macromolecular layer 2 laminated on at least one part of the sheet 1. The thermal conductivity in a thickness direction of the macromolecular layer 2 is set so as to be larger than the thermal conductivity in a direction parallel to the surface of the macromolecular layer 2. The heat dissipation component is manufactured by laminating the macromolecular layer 2 including a thermal conductive filler previously oriented in a predetermined direction, on the sheet 1. The heat dissipation component can also be manufactured by laminating a thermally conductive macromolecular composition containing a thermal conductive filler on the sheet 1, orienting the thermal conductive filler in a predetermined direction, and curing the thermally conductive macromolecular composition in a state of maintaining the orientation. <P>COPYRIGHT: (C)2007,JPO&INPIT</p>
申请公布号 JP2007012911(A) 申请公布日期 2007.01.18
申请号 JP20050192436 申请日期 2005.06.30
申请人 POLYMATECH CO LTD 发明人 OTA MITSURU;YAMAZAKI JUN;HIDA MASAYUKI
分类号 H01L23/36 主分类号 H01L23/36
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