| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat sink which can secure installation spaces of other circuit component while keeping a desired heat dissipation effect and contribute to the miniaturization of an electronic apparatus, and the electronic apparatus having the heat sink. SOLUTION: The heat sink 34 fixed to an LSI 32 mounted on a circuit substrate 31 of an electronic apparatus has heat sinks 34d, 34e which extend almost parallel to the circuit substrate 31, and has a plurality of radiation fins 34f extending from the heat sink toward the circuit substrate 31. The radiation film 34f is shortened for securing mounting spaces of the other circuit components 37, 38 mounted on the circuit substrate 31. COPYRIGHT: (C)2007,JPO&INPIT |
