| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of a circuit device wherein a plurality of circuit elements are mounted on a substrate made of metal or semiconductor. SOLUTION: A plurality of circuit elements 142a (an element that does not operate stably under a predetermined low temperature range) and 142b (an element provided with a resistance heating body 142b1 as a heat generating source) are embedded in an insulating resin film 122 and a circuit element such as a passive element 144 or the like, and are provided on a substrate 140 formed of a three-layer structure clad material. A heat from the heat generating source included in the circuit element 142b is conducted to the substrate 140, so as to heat the circuit element 142a. COPYRIGHT: (C)2007,JPO&INPIT
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