| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed circuit board to prevent peeling of a circuit pattern from an insulating base material in the process after formation of the circuit pattern such as terminal plating process, and electronic component mounting process, and to prevent peeling of the circuit pattern in the usage environment after completion of manufacturing process from the insulating base material, by acquiring close contact rigidity of circuit pattern for the insulating base material even in the case where fine circuit patterns are formed with the "semi-additive method", etc. SOLUTION: The printed circuit board comprises an insulating base material 1 formed of an insulating material, a circuit pattern 2 formed of a conductive material on the surface of this insulating material 1, a cover layer 4 formed of an insulating material on the insulating base material to cover the circuit pattern 2 with inclusion of an aperture 6 corresponding to the mounting location 5 of an electronic component 101 in the circuit pattern 2, and an oxygen preventing film 7 formed of an organic material to the location corresponding to the aperture 6 of at least cover layer 4 of the backside of the insulating base material 1. COPYRIGHT: (C)2007,JPO&INPIT
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