| 摘要 |
PROBLEM TO BE SOLVED: To provide surface treated copper foil having a smooth surface, and whose adhesion with polyimide is satisfactory, and to provide a method for producing the same. SOLUTION: Regarding the copper foil for a printed circuit board, in copper and copper alloy foil whose ten point average roughness Rz<SB>JIS</SB>(JIS B 0601(2001)) is≤2.0μm, at least the face to be stuck with resin has an Fe or Fe alloy layer. The Fe alloy is an alloy of one or more kinds selected from Ni, Co, Mo, W, Zn and Cu. COPYRIGHT: (C)2007,JPO&INPIT
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