| 发明名称 |
SHEET PEELING APPARATUS AND SHEET PEELING METHOD |
| 摘要 |
<p>A sheet peeling apparatus is provided for peeling an unnecessary adhesive sheet (S1) positioned on an outer side by cutting an adhesive sheet (S) along an outer periphery of a wafer (W) supported on an upper plane of a table (13), after adhering the adhesive sheet (S) on a plane of the wafer (W). The peeling apparatus is provided with a small diameter roller (70) which sandwiches the adhesive sheet (S) with the wafer (W), and a large diameter roller (71) for sandwiching the adhesive sheet (S) with the small diameter roller (70), and the unnecessary adhesive sheet (S1) is peeled by shift of the rollers (70, 71) along the table (13).</p> |
| 申请公布号 |
WO2007007534(A1) |
申请公布日期 |
2007.01.18 |
| 申请号 |
WO2006JP312688 |
申请日期 |
2006.06.26 |
| 申请人 |
LINTEC CORPORATION;NONAKA, HIDEAKI;NAKATA, KAN;KOBAYASHI, KENJI |
发明人 |
NONAKA, HIDEAKI;NAKATA, KAN;KOBAYASHI, KENJI |
| 分类号 |
H01L21/683;H01L21/301;H01L21/304 |
主分类号 |
H01L21/683 |
| 代理机构 |
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代理人 |
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| 主权项 |
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