| 摘要 |
Semiconductor etching equipment including a cooling unit is provided to avoid or minimize breakdown of an RF(radio frequency) matching box caused by overheating by installing a water-cooling unit or an air-cooling unit in the RF matching box. An RF matching box(130) generates Rf power, installed on or under a reaction chamber. A cooling unit cools the heat generated from the RF matching box. The cooling unit can be an air-cooling unit for cooling the RF matching box by using air, including a blower(110) and a ventilation fan(120).
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