| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a wafer-polishing method and a wafer-polishing device used for polishing wafers, capable of detecting a film thickness during polishing without separating a wafer from a surface plate in midstream of polishing, and capable of efficiently controlling polishing with high accuracy. <P>SOLUTION: In the wafer-polishing method for polishing while pushing a film-coated wafer to a surface plate, a polishing surface of the wafer is irradiated with light by passing through a part of the surface plate, and a reflected light from the wafer having passed through the surface plate is monitored, and accordingly the film thickness is measured in midstream of polishing. <P>COPYRIGHT: (C)2007,JPO&INPIT |
