| 摘要 |
PROBLEM TO BE SOLVED: To prevent an outflow of a sealing material at a connecting part, an exposing part, etc. of a wiring board by a simple constitution from occurring. SOLUTION: A module frame 11 has a pair of projections 11e formed to be opposed to each other in a head chip stationing hole. A nozzle sheet 25 is arranged so that nozzles are positioned within the head chip stationing hole of the module frame 11, and is arranged to cover each projection 11e in the head chip stationing hole. Each head chip 20 is arranged in each head chip stationing hole so that a heating resistor and the nozzle are disposed at opposed positions. A flexible wiring board 3 is arranged so that its electrode and an electrode of the head chip 20 are electrically connected with each other. A gap between the head chip 20 and the module frame 11 of the side where the flexible wiring board 3 is set is sealed by the sealing material 29. COPYRIGHT: (C)2007,JPO&INPIT
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