<p>A light beam (330) is used to cut a slot (140) in a first side of substrate (125). An optical sensor (370) monitors a surface (142) of a second side of the substrate (125) that is opposite the first side while cutting the slot (140). If the light beam (330) breaks through the surface (142) of the second side, the sensor (370) detects the light beam (330).</p>
申请公布号
WO2007008353(A1)
申请公布日期
2007.01.18
申请号
WO2006US24027
申请日期
2006.06.19
申请人
HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.;GRAEME, SCOTT;O'BRIEN, SEAMUS;CAMPBELL-BROWN, IAIN
