| 摘要 |
PROBLEM TO BE SOLVED: To provide the substrate for a package of at least one semiconductor element, and a method for manufacturing the substrate for making it unnecessary to provide the surplus mounting process of heat dissipation equipment. SOLUTION: This method for manufacturing a substrate for a package of a semiconductor light emitting element comprises a step (a) for forming a first frame, a base 11 having a peripheral edge and bottom and upper faces, and at least one first support part formed for connecting the first frame and the base by punching a first metallic board; a step (b) for forming a second frame to be engaged with the first frame, N pieces of joints 13 having joint pads, and N pieces of external electrodes 15 formed for connecting the second frame to one of the joints 13; a step for setting N as a positive integer which is 2 or more, a step (c) for paletting the second frame on the first frame, and a step (d) for molding an insulating member 17 and for substantially packaging the base and the joints. COPYRIGHT: (C)2007,JPO&INPIT
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