| 摘要 |
PROBLEM TO BE SOLVED: To provide a high-productivity plating method capable of uniformly applying plating even to a film having a high surface resistivity. SOLUTION: The plating method is for continuously electroplating the surface of a film having a surface resistivity of 1 to 1,000Ω/square, wherein a film 16 to be electroplated is continuously plated in a plating bath 11 containing a plating solution 15 having a copper concentration of 150 to 300 g/L by weight in terms of copper sulfate pentahydrate and optionally containing other sulfur compounds, nitrogen compounds, or polymer components. COPYRIGHT: (C)2007,JPO&INPIT
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