| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition capable of improving solvent removing efficiency in drying, when a semiconductor chip is coated with an under-filling material and dried in sealing for preapplication, capable of shortening a time for a drying process, and excellent in maintaining a pot life for a long period and flux characteristics due to shortening of the heating time. SOLUTION: This resin composition is used as a sealing resin for the preapplication, wherein the resin composition comprises a thermosetting resin, a curing agent, a first solvent which is a good solvent for the thermosetting resin and is a poor solvent for the curing agent, and a second solvent of which the boiling point is lower than that of the first solvent. COPYRIGHT: (C)2007,JPO&INPIT
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