| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring board which exhibits a high adhesion property between its resin layer and its adhesive layers. SOLUTION: The wiring board 11 is provided with the resin layer 51 mainly composed of a non-thermoplastic resin, and the adhesive layers 61 and 71 mainly composed of polyetheretherketon. The adhesive layers 61 and 71 are bonded to major surfaces 52 and 53 of the resin layer 51. In this case, the major surfaces 52 and 53 have uneven faces 58 each of which exhibit a surface roughness Ra of 0.249μm and a surface roughness Rz of 0.793μm. In this way, since the adhesive layers 61 and 71 partially get in concave portions of the uneven faces 58 at the time of bonding between the resin layer 51 and the adhesive layers 61 and 71, the adhesion property is improved between them. COPYRIGHT: (C)2007,JPO&INPIT
|
