| 摘要 |
<p>A bonding apparatus and method of metal plates simplifies a bonding process and improves bonding strength of metal plates. A bonding apparatus of metal plates may include an upper mold having a first guide pathway formed vertically inside thereof; a middle mold having a second guide pathway formed vertically inside thereof, the middle mold being disposed under the upper mold; a lower mold having a metal removing pathway formed vertically inside thereof, the lower mold being disposed under the middle mold; a heating unit for heating the metal plates and a metal tape; a punch for applying a bonding load to the metal plates; a clamping unit that applies a clamping load for clamping the metal plates to the upper mold; and a bonding unit that applies the bonding load to the punch for bonding the metal plates.</p> |
