发明名称 |
METHOD FOR PREPARING COPPER FOIL WITH INSULATING LAYER AND COPPER FOIL WITH INSULATING LAYER PREPARED BY THE METHOD, AND PRINTED WIRING BOARD USING THE COPPER FOIL WITH INSULATING LAYER |
摘要 |
<p>To provide a method of manufacturing a material which can make a skeletal component as thin as possible to be contained in an insulating layer in a manufactured copper clad laminate and can securely prevent the direct contact between the nodular treatment surface of the attached copper foil and a skeletal component. In order to attain the object, here is adopted "a method of manufacturing a copper foil with an insulating layer 1 which method is a method of manufacturing a copper foil provided with a semi-cured insulating resin layer containing a skeletal component on one side surface of the copper foil, and is characterized in that: a first thermosetting resin layer 3 in an uncured or semi-cured state is provided on one side surface of a copper foil 2 ; a nonwoven fabric 5 or a woven cloth 5 to be a skeletal component is press-bonded onto a first thermosetting resin layer 3 ; a second thermosetting resin layer 7 is formed on a surface of a press-bonded nonwoven fabric 5 or woven cloth 5 ; and a semi-cured insulating layer containing the nonwoven fabric 5 or the woven cloth 5 is formed on one side surface of the copper foil 2 by drying into a semi-cured state."</p> |
申请公布号 |
KR100670752(B1) |
申请公布日期 |
2007.01.18 |
申请号 |
KR20037009789 |
申请日期 |
2003.07.24 |
申请人 |
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发明人 |
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分类号 |
B32B15/08;H05K3/00;H05K1/03;H05K3/38;H05K3/46 |
主分类号 |
B32B15/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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