| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method for mounting an IC chip by which the IC chip is reliably fixed to an antenna circuit with a low contact resistance between the IC chip and bumps, so that conduction between circuit terminals of the antenna and the bumps of the IC chip may not be broken by a physical shock or vibration. <P>SOLUTION: An adhesive layer is formed on a pair of terminals of the antenna circuit 2 formed on a substrate 1. The IC chip is positioned by sticking bumps 4 shaped like mushrooms in it from above the terminals, and then is mounted by heat setting an adhesive agent 3. <P>COPYRIGHT: (C)2007,JPO&INPIT |
