NON-CONTACT IC CHIP MOUNT BODY MOUNTING CORRUGATED CARDBOARD AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a non-contact IC chip mount body mounting corrugated cardboared constituted by easily attaching the non-contact IC chip mount body to corrugated cardboard and capable of avoiding the collision and abrasion due to an external article and content.

SOLUTION: The non-contact IC chip mount body mounting corrugated cardboard is constituted by providing the non-contact IC chip mount body 4 to the gap part V2 between at least one liners 1 and 3 and the corrugated inner medium 2 bonded to the surfaces of the liners. By this constitution, the non-contact IC chip mount body can be easily mounted and the collision and abrasion due to the external article and content with respect to the non-contact IC chip mount body can be prevented.

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