| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board which is thin and light in weight, highly accurate and highly reliable, and can be manufactured at a low cost, and its manufacturing method. SOLUTION: The manufacturing method of the circuit board comprises a laminating process of subsequently laminating an exfoliation layer 2 and a diffusion prevention layer 3 on a plate board 1; an element formation process of laminating a heat resistant high polymer film 4 on the diffusion prevention layer 3, and forming a thin film semiconductor element 14 on the heat resistant high polymer film 4 into a laminate plate board 15; a transfer process of superimposing a support resin layer 16 on the laminate plate board 15, and fixing the thin film semiconductor element 14 and the heat resistant high polymer film 4 on the laminate plate board 15 to the support resin layer 16; and a removal process of removing the plate board 1 and the exfoliation layer 2. COPYRIGHT: (C)2007,JPO&INPIT |
