| 摘要 |
PROBLEM TO BE SOLVED: To provide a flip-chip bonding method making a flip-chip bonded joint larger in height. SOLUTION: The flip-chip bonding method has been realized by improving a flip-chip bonding method of bonding the metal bumps of a semiconductor chip to the terminals of a printed board with solder. The bonding method is carried out in the manner wherein solder is applied onto the metal bumps of the semiconductor chip and the terminals of the printed board respectively, and the metal bumps of the semiconductor chip and the terminals of the printed board are bonded together with solder. COPYRIGHT: (C)2007,JPO&INPIT |
