| 摘要 |
PROBLEM TO BE SOLVED: To reduce polishing costs of a first plate which secures supporting a recording element substrate, and to prevent breakage of a second plate which secures an electric wiring tape. SOLUTION: The recording element substrates H1100 and H1101 which eject a liquid such as ink are bonded to a first supporting part H1202 of the first plate H1200. The second plate H1400 which supports the electric wiring tape H1300 is bonded to a second supporting part H1203 of the first plate H1200. The first supporting part H1202 of the first plate H1200 projects more than the second supporting part H1203, and therefore it is enough to polish only the first supporting part H1202 which supports the recording element substrates H1100 and H1101. The strength of the second plate H1400 can be increased by increasing the thickness of the second plate H1400 by an amount of the projection of the first supporting part H1202. COPYRIGHT: (C)2007,JPO&INPIT
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