摘要 |
Disclosed is a method of producing a mold for preparing a hydrophobic polymer substrate including forming an adhesion enhancer on a substrate, forming a first conductive layer on the adhesion enhancer, adhering a predetermined patterned hydrophobic template on the first conductive layer, forming a second conductive layer on the template to prepare a template assembly, metal electroplating on the template assembly to form a metal plating layer on the template assembly, and removing the first conductive layer, the second conductive layer, the adhesion enhancer, and the template from the template assembly.
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