| 摘要 |
External connection terminals 27 which are electrically connected to semiconductor chips 11 - 1, 11 - 2, 12 - 1, 12 - 2 and also protrude beyond the semiconductor chips 11 - 1, 11 - 2, 12 - 1, 12 - 2 are disposed on a substrate 13 of the side to which the plural semiconductor chips 11 - 1, 11 - 2, 12 - 1, 12 - 2 are connected.
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