发明名称 |
Submount of semiconductor laser diode, method of manufacturing the same, and semiconductor laser diode assembly using the submount |
摘要 |
Provided is a submount flip-chip bonded to a semiconductor laser diode chip with stepped first and second electrodes. The submount includes a substrate having first and second surfaces which are separated by a step height corresponding to a height difference between the first and second electrodes; first and second metal layers being formed to the same thickness on the first and second surfaces, respectively; and first and second solder layers being formed to the same thickness on the first and second metal layers, respectively, and being bonded to the first and second electrodes, respectively.
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申请公布号 |
US2007015313(A1) |
申请公布日期 |
2007.01.18 |
申请号 |
US20060477911 |
申请日期 |
2006.06.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KWAK JOON-SEOP;CHAE SU-HEE;SUNG YOUN-JOON |
分类号 |
H01L21/00;H01S5/022;H01L21/302;H01L21/461;H01S5/02;H01S5/024;H01S5/20;H01S5/22;H01S5/323 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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