| 摘要 |
The present disclosure pertains to a wafer box for transporting semiconductor wafers, typically in a coin stack configuration. The wafer box includes an outer box and at least one inner box. The semiconductor wafers are placed in the inner box or boxes, typically with appropriate separators and interleaves. The outer box includes a tray portion and a lid portion. The tray portion includes posts rising from its floor which are received by sleeves in the inner box. Shock absorbing rings are placed on the posts both above and below the inner box or boxes in order to provide protection against vertical shocks. Moreover, the outer box includes radially pivoting latching elements with padded bumper elements. These padded bumper elements are brought to an upright position to urge against the inner box or boxes in order to provide horizontal or lateral shock protection.
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