MULTILAYER WIRING STRUCTURE AND METHOD FOR FORMING SAME

摘要

In a multilayer wiring structure, an upper layer wiring is formed in an interlayer insulating film on a lower wiring composed of copper, and the lower layer wiring composed of copper and the upper wiring are connected through a via formed in the interlayer insulating film. A layer in contact with the lower wiring in the interlayer insulating film is composed of a layer having an aromatic compound, which includes a nitrogen atom having a lone pair in an aromatic ring, as a main component.