| 摘要 |
Wiring boards (11 & 12) are disposed on a fixed base (10) so as to have a step difference, and radiation imaging elements (2, 3) formed by depositing scintillators (25, 35) on photosensitive units (21, 31) respectively are mounted on the boards. The radiation imaging element (2) is disposed so that its mounting surface protrudes beyond the radiation incident surface of the radiation imaging element (3), and the photosensitive unit (21) of the element (2) and the photosensitive unit (31) of the element (3) are disposed close to each other without being overlapped each other. The photosensitive unit (21) of the element (2) extends up to the vicinity of the edge on the radiation imaging element (3) side, and the scintillator (25) almost uniform in thickness is formed up to that position. ® KIPO & WIPO 2007 |
