| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a circuit board which removes bubbles generating between a pad electrode and a land. <P>SOLUTION: A resist 13A and a resist 13B are formed at either one end of a land 11A on the circuit board. A solder paste 12A is printed on the land 11A, and electronic parts (MOSFET, etc.) are placed thereon for heating. When the solder paste 12A is melted, electrodes of the electronic parts are brought into contact with the resist 13A and resist 13B on the circuit board. A gap caused by the resist 13A and resist 13B occurs between the land 11A and the electrodes of the electronic parts. Since the melted solder paste 12A is not wet with the resist 13A and resist 13B, the bubbles generating in a solder pass through the gap and go out to an end of the land 11A. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
