| 摘要 |
PROBLEM TO BE SOLVED: To provide a transparent conductive layer transcription film for enabling to laminate a transparent conductive film even on a curved face, and to provide a resin molding equipped with the transparent conductive film which is obtained by using the transparent conductive layer transcription film for the resin molding equipped with the curved face. SOLUTION: A conductive layered film obtained by laminating the conductive layer by conductive materials by using a thermoplastic resin film as the base material in in-mold molding die is installed, subsequently by manufacturing the resin molding by an in-mold molding method using that mold, subsequently by peeling off the base material constituting the conductive layer laminated film, subsequently by oxidizing the conductive layer exposed on the outermost surface by heat-treating the resin molding while the base material has been peeled off, and by making this as the transparent conductive film. COPYRIGHT: (C)2007,JPO&INPIT
|
