RESIN ETCHING LIQUID, METHOD FOR ETCHING RESIN, METHOD FOR RELEASING RESIN AND METHOD FOR PRODUCING FLEXIBLE PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide an etching liquid of a polyimide resin having excellent shape reproducibility of a hole of even a through-hole and a blind via hole having≤100μm size, affording a microscopically viewed smooth hole wall and having a long life, to provide a method for etching a polyimide film using a photosensitive resin film carrying out an alkali development treatment as a resist, to provide a method for forming a cover lay composed of the polyimide resin in a high-accuracy and high-definition pattern form using a negative type photosensitive resin film and to provide a method for releasing the polyimide resin. SOLUTION: The etching liquid of the polyimide resin is characterized as comprising an aqueous solution containing 10-40 mass% of N-(β-aminoethyl)ethanolamine and 20-40 mass% of potassium hydroxide. The method for etching, method for forming the cover lay and method for releasing the resin comprise using the etching liquid. COPYRIGHT: (C)2007,JPO&INPIT