MICRO-STRUCTURED COOLER AND USE THEREOF

摘要

For providing a particularly efficient micro-structured cooler intended more specifically for cooling electronic components, it is proposed to proceed in the following manner to build this cooler: providing a stack of at least two metal foils (1) comprising channels (2) for coolant and one base plate (5) adapted to be brought into thermal contact with the electronic component (4) through a thermal contact surface (6), said metal foils (1) and said base plate (5) being joined together so as to form a single piece of material, said channels (2) having a width b ranging from 100 to 350 µm, a depth t ranging from 30 to 150 µm, a mean spacing s ranging from 30 to 300 µm, residual foil thickness r remaining after formation of the channels (2) in the metal foils (1) ranging from 30 to 300 µm and said base plate (5) having a thickness g ranging from 100 to 1 ,000 µm, said cooler further having at least one splitting chamber (10) traversing the metal foils (1) approximately in the region of the thermal contact surface (6), said chamber communicating with a respective inlet-side end of all or of selected channels (2) through channel inlet ports, at least one inlet chamber (20) for admission of coolant into the cooler (3), said chamber communicating with the at least one splitting chamber (10), at least one collecting chamber (11) traversing the metal foils (1) and communicating with a respective outlet-side end of all or selected channels (2) through channel outlet ports and at least one outlet chamber (21) for discharging coolant from said cooler (3), said chamber communicating with said at least one collecting chamber (11), the depth of said channels (2) in a channel layer adjacent said base plate (5) being greater than the depth of the channels (2) in a channel layer located in the stack on the side opposite said base plate (5).