| 摘要 |
<p>Disclosed is a lead-free metal solder material which enables to attain excellent bonding strength and hermetic sealing. Specifically disclosed is a solder alloy for oxide bonding which is composed of, in mass%, 2.0-15.0% of Ag, more than 0.1% to 6.0% of Al and the balance of Sn and unavoidable impurities. The amount of Al is preferably 0.3-3.0%, and more preferably 0.5-1.5%. The amount of Ag is preferably 3.0-13.0%, more preferably more than 5.0% to 12.0%, and still more preferably 6.0-10.0%. The relation between Ag and Al preferably satisfies 0 < [(%Ag) - (%Al) × 7.8] < 10.</p> |
