| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method by which accurate positioning of a substrate is performed quickly and with high accuracy, even if there exits many impeding factors, wherein such positioning is required to accurately process the substrate by lithography equipment. <P>SOLUTION: The method includes steps of (a) a position of a window into which an alignment mark is likely to be put is determined on a substrate W from a geometric basis, (b) the position of the alignment mark is measured in the window, (c) a relation is determined between the actually measured position of the alignment mark and the position of the window, (d) the relation is memorized in a database, and (e) the substrate W is aligned using the actually measured position of the alignment mark. These steps are repeated for alignment of subsequent substrates, but before measuring the position of the mark, the position of the window is corrected using the relation memorized for one or more alignment in prior arts. The result of the preceding alignment is memorized, and various data processing is performed for it, by which the alignment of high accuracy and high reliability is obtained, and a possibility of a mutual operation is made higher between different processing equipment. <P>COPYRIGHT: (C)2007,JPO&INPIT |
