| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor inspection device capable of shortening a test time. SOLUTION: A semiconductor inspection device 100 comprises: a plurality of probe cards 2 comprising a bi-movable contact probe 12 of which a contact piece 10 is provided on a lower side and a pad 11 which is electrically conductive to the contact piece 10 is provided on an upper side; a wafer holding part 3 for holding stacked semiconductor wafers 1; a contact pressure applier 4 for applying a pressure from above the top probe card 2; a bottom probe card board 5 arranged below a bottom probe card 2; and a contact tester for testing conductive state from the pad 11 of the top probe card 2 to the contact piece 10 of the bottom probe card 2. If the contact test judges that there is no conduction, the pressure is applied from the upper surface side of the top probe card 2. COPYRIGHT: (C)2007,JPO&INPIT
|
