发明名称 Methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating memory circuitry, integrated circuitry and memory integrated circuitry
摘要 The invention includes methods of forming trench isolation in the fabrication of integrated circuitry, methods of fabricating integrated circuitry including memory circuitry, and integrated circuitry such as memory integrated circuitry.
申请公布号 US2007015339(A1) 申请公布日期 2007.01.18
申请号 US20060527347 申请日期 2006.09.25
申请人 发明人 SANDHU GURTEJ S.
分类号 H01L21/76;H01L29/00 主分类号 H01L21/76
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