| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the size of a semiconductor device having a multi-chip. <P>SOLUTION: In an HSOP 46 (semiconductor device) for driving a 3-phase motor, a first semiconductor chip 30 containing a p-MISFET and a second semiconductor chip 31 containing an n-MISFET are mounted on a first tab 34, a second tab 35, and a third tab 36, respectively; and drains of the p-MISFET and n-MISFET of respective tabs are electrically connected to one another. Thus, six MISFETs are disposed two by two on each of the three tabs divided corresponding to the number of a phase of a motor and can be compactly housed in one package. As a result, it is possible to reduce the size of the HSOP 46 for driving the 3-phase motor having the multi-chip. <P>COPYRIGHT: (C)2007,JPO&INPIT |
