| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device capable of preventing expansion or peeling caused by the heating expansion of water contents which an insulating substrate has absorbed. <P>SOLUTION: The semiconductor device comprises an insulating substrate that has a die-bonding region where a semiconductor chip is die-bonded, and a semiconductor chip that is die-bonded to the die-bonding region. The insulating substrate comprises a hollow through hole formed at least at the corner of the die-bonding region with the through hole exposed to the outside. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
