| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer transfer device which can suppress degradation in flexural strength of a wafer. SOLUTION: The wafer transfer device transfers a wafer by vacuum-sucking it by means of a sucking portion. The sucking portion is formed of a material, chief of which is aluminum, and has a porosity of 34-40%. The surface roughness Ry of other part of the surface of the sucking portion than pores is 5μm or less, which reduces an unevenness of a contact plane of the sucking portion with the wafer and thereby reduces the damages to the wafer. Consequently, degradation in flexural strength of the wafer which occurs at the time of holding the wafer by suction force by means of the sucking portion can be suppressed. COPYRIGHT: (C)2007,JPO&INPIT |
