Semiconductor device and manufacturing method thereof

摘要

A manufacturing method of a semiconductor device is disclosed. The manufacturing method includes a first step that mounts plural semiconductor elements (107) on a first substrate (101), a second step that inspects each of the semiconductor elements (107) mounted on the first substrate (101), a third step that divides the first substrate (101) by dicing so that a divided first substrate (101) includes at least one semiconductor element (107), and a fourth step that mounts the divided first substrate (101) in which at least one semiconductor element (107) is mounted on a second substrate (201).