INTERCONNECTION METAL, METHOD FOR FABRICATING THE SAME, THIN FILM TRANSISTOR PLATE AND METHOD FOR FABRICATING THE SAME

摘要

A wire, a method for forming the wire, a thin film transistor substrate, and a method for manufacturing the thin film transistor substrate are provided to improve the adhesive force between the wire and a lower layer, thereby preventing the exfoliation of the wire, by disposing a solid solution layer below a low resistance metal layer in the wire. A wire is composed of an adhesive metal layer(2), a solid solution layer(4), a low resistance metal layer(6), and a transparent conductive layer(8) sequentially formed on a substrate(1). The adhesive metal layer is formed of a material, which has an excellent adhesive property and reduces the contact resistance. The solid solution layer is formed by heating a low resistance metal material and a predetermined metal material, which forms a solid solution together with the low resistance metal material.