发明名称 JOINT BOND SPREADING SYSTEM FOR INNER AND OUTER COVER OF PAPER CUP
摘要 A system for applying a bond on a joint part between inner and outer covers of a paper cup is provided to conveniently spread the bond by moving the bond to a supply nozzle and feeding the bond to the edge of a fan-shaped paper in a dotted line form. In a system for forming a paper cup(10) by applying a bond(22) on the inside of a truncated cone-shaped outer cover(12) and then joining an inner cover(11) to the inside of the outer cover, the bond applying system automatically spreads the bond on the inner peripheral surface of the outer cover in a line form and then the inner cover is joined. A bond container(21) filled with the bond is installed in a pressure case(20). A bond supply hose(24) combined with a filter(23) is connected to the bond. A pressure gauge(26) is installed at the upper part of the pressure case to check the internal pressure. A compressor valve(25) controls the pressure of the pressure case. The bond supply hose dipped in the bond is extended to the outside to discharge the bond to a rotary plate(30) by a supply amount regulating valve(27) and a bond supply control valve(28). A rotating pneumatic pressure supply valve(29) drives the rotary plate. The rotary plate is turned by receiving pneumatic pressure from the outside, the bond falling from the rotary plate is applied on the inner peripheral surface of the outer cover in a line form by rotational centrifugal force, and then the inner cover is adhered on the inside of the outer cover.
申请公布号 KR20070008480(A) 申请公布日期 2007.01.17
申请号 KR20060129790 申请日期 2006.12.19
申请人 YUN, BOK SUN 发明人 YUN, BOK SUN
分类号 B05D1/40 主分类号 B05D1/40
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